Name: micro-masonry for 3d additive micromanufacturing
Uploaded: 2014-08-01T15:00:00.000+00:00
Duration: 8 min 45 s
Description: Watch this Scientific Journal Video about Micro-masonry for 3D Additive Micromanufacturing at JoVE.com

This work was supported by the NSF (CMMI-1351370).

1. Maschere di progettazione per la fabbricazione di donatori substrato <ol><li> Progettare una maschera con geometria desiderata. Per fabbricare 100 micron x 100 micron unità individuali silicio quadri, disegnare una matrice di 100 micron x 100 micron quadrati. </li><li> Progettare una seconda maschera con una geometria identica, con ogni lato che si estende su un ulteriore 15 micron. Per la serie di 100 micron x 100 micron quadrati, disegnare un array di 130 micron x 130 micron quadrati in grado di coprire le piazze nella fase 1.1. </li><li> Progettare la geometria di ancoraggio. Disegna quattro 20 micron x 40 micron rettangoli, ognuno incentrato lungo un bordo di un quadrato. Posizionare le strutture in modo che il primo 15 micron copre l&#39;originale 100 micron x 100 micron quadrato nel passo 1.1 e il restante 25 micron si estende verso l&#39;esterno (come mostrato in Figura 2). NOTA: Qualsiasi forma e le dimensioni possono essere usati fino a quando i contatti di ancoraggio sia il materiale modellato e il substrato. Un&#39;estremità di questa ancora copre l&#39;origineAl geometria nel passaggio 1.1 e l&#39;altra estremità deve estendere la geometria nel passaggio 1.2. </li></ol> 2. Preparare Retrievable donatori substrato <ol><li> Preparare un silicio drogato di tipo p su isolante (SOI) wafer con 3 dispositivo micron spessore, con resistenza dello strato di 1-20 Ω • cm e scatola spessore dello strato di ossido di 1 micron. NOTA: Per le varie applicazioni di questi parametri possono essere modificati. </li><li> Spin cappotto photoresist (AZ5214, 3.000 rpm per 30 sec, 1,5 micron di spessore) e fissare la maschera progettata nella fase 1.1. </li><li> Utilizzando una incisione a ioni reattivi (RIE) strumento, modello strato periferica del wafer SOI e rimuovere la maschera di fotoresist. Dopo questo passo, la regione inciso RIE ha esposto lo strato di ossido di dialogo (Figura 2A). </li><li> Spin cappotto photoresist (AZ5214, 3.000 rpm per 30 sec, 1,5 micron di spessore) ed il modello con la mascherina disegnata nel passaggio 1.2. </li><li> Riscaldare il wafer a 125 ° C per 90 secondi su una piastra calda. </li><li> Immergere il wafer in49% HF per 50 sec per incidere lo strato di ossido casella esposto dal punto 2.3. Dopo completa essiccazione, rimuovere il photoresist mascheratura (Figura 2B). </li><li> Cappotto Spin (AZ5214, 3.000 rpm per 30 sec, 1,5 micron di spessore) e il modello il disegno di ancoraggio dal punto 1.3. </li><li> Riscaldare il wafer a 125 ° C per 90 secondi su una piastra calda. </li><li> Immergetevi nel 49% HF per 50 min. Questo passaggio incide lo strato di ossido casella restante sotto il restante silicio strato modellato dispositivo, con conseguente sospensione silicio unità individuali sul photoresist (Figura 2C). </li></ol> 3. Maschere di design per uno Stamp microtip <ol><li> Progettare una maschera con un solo 100 micron x 100 micron quadrati. </li><li> Progettare una maschera con più 12 micron x 12 micron quadrati all&#39;interno di un 100 micron x 100 micron zona. </li></ol> 4. Fare la muffa per uno Stamp microtip <ol><li> Pulire un wafer di silicio con orientazione cristallina &lt;1-0-0&gt;, deposit 100 nm di nitruro di silicio utilizzando Plasma avanzata Chemical Vapor Deposition (PECVD) attrezzature. </li><li> Spin cappotto photoresist (AZ5214, 3.000 rpm per 30 sec, 1,5 micron di spessore) ed il modello con la mascherina disegnata nel passaggio 3.2. </li><li> Motivo dello strato di nitruro di silicio utilizzando 10:01 Buffered Oxide Etchant (BOE). </li><li> Sciogliere 80 g di idrossido di potassio (KOH) in 170 ml di acqua deionizzata e 40 ml di alcool isopropilico (IPA) miscela un becher. </li><li> Riscaldare la, IPA, e miscela acqua KOH al 80 ° C su una piastra calda. </li><li> Posizionare verticalmente il wafer preparati nel beker con miscela KOH per incidere il silicio esposto a struttura cristallina (velocità di attacco è di circa 1 micron / min). </li><li> Dopo il silicio esposto è completamente inciso, rimuovere il wafer da miscela di KOH, etch via il nitruro di silicio con HF ed eseguire RCA 1 e 2 RCA pulizia (Figura 3A). </li><li> Spin cappotto con SU-8 100 e modello con la maschera preparata dal punto 3.1 con il seguente ricetta: 3.000 rpm per 1 min, cuocere morbido a 65 ° C per 10 min e 95 ° C per 30 min, esporre con 550 mJ / cm 2, e post cuocere in forno a 65 ° C per 1 minuto e 95 ° C per 10 min (Figura 3B ). </li><li> Dopo il SU-8 100 è completamente guarito, applicare un monostrato di (tridecafluoro-1 ,1,2,3-tetraidro ottil)-1-triclorosilano facendo cadere 3-5 gocce di (tridecafluoro-1, 1,2,3 - tetraidro ottil)-1-triclorosilano in un vaso vuoto e mettendo il wafer nel vaso e applicando il vuoto. </li></ol> 5. Duplicare uno Stamp microtip utilizzando uno stampo <ol><li> Mescolare polidimetilsilossano (PDMS) base e il catalizzatore con il rapporto di 5:1. </li><li> Degassarla miscela ponendolo in un vaso vuoto. </li><li> Versare una piccola porzione della miscela degasato PDMS sullo stampo e lasciare che il riflusso PDMS per ottenere una superficie superiore piana (Figura 3C). </li><li> Collocare lo stampo con PDMS nel forno a 70 ° C per 2 ore per curare completamente il PDMS. </li><li> Rimuovere lo stampo dallaforno e sbucciare le PDMS off (Figura 3D). </li></ol> 6. Recuperare inchiostro dal supporto dei donatori e stampa sullo Spazio target <ol><li> Posizionare il substrato donatore, su fasi y-rototraslazione ed x motorizzato provvisto di un microscopio. </li><li> Attaccare il timbro microtip ad una fase di traslazione verticale indipendente. </li><li> Al microscopio, allineare il timbro micropunte con l&#39;inchiostro sul substrato di Si donatore mediante traslazione e rotazione fasi. Inoltre, fare l&#39;allineamento inclinazione tra la superficie microtip e l&#39;inchiostro Si regolando una fase di ribaltamento. Successivamente, portare il timbro microtip giù per fare contatto. </li><li> Lentamente portare il timbro micropunte ridurre ulteriormente dopo il contatto iniziale, in modo che le piccole punte sono completamente crollati e l&#39;intera superficie è a contatto con l&#39;inchiostro Si su substrato donatore. </li><li> Aumentare rapidamente la fase z, rompendo le ancore a causa della grande area di contatto tra il timbro micropunte e l&#39;inchiostro Si, per rRECUPERO l&#39;inchiostro Si dal substrato donatore e allegarlo al timbro microtip. NOTA: Quando il timbro microtip è priva di qualsiasi stress, la microtip compresso restituisce alla sua forma piramidale originale, rendendo minimo contatto con l&#39;inchiostro Si recuperato. </li><li> Posizionare il ricevitore su un substrato x, y-stadio traduzione e allineare l&#39;inchiostro Si recuperato sotto il timbro micropunte nella posizione desiderata. </li><li> Scendere la fase z finché l&#39;inchiostro Si recuperato rende a malapena contatto con il substrato ricevitore. </li><li> Dopo il contatto, sollevare lentamente la fase z per rilasciare l&#39;inchiostro Si, stampandolo sulla posizione desiderata. </li></ol> 7. Processo di incollaggio <ol><li> Programmare un forno di ricottura termica rapida ciclare da RT fino a 950 ° C in 90 sec, rimangono a 950 ° C per 10 minuti e raffreddare a RT (eliminando qualsiasi fornitura di calore nel forno). </li><li> Posizionare il substrato ricevente stampato in forno in un ambiente di aria ambiente e ricottura a 950 °C per 10 min per Si-Si incollaggio oa 360 ° C per 30 min per Si-Au bonding. </li></ol>

<ol>
	<li>Stix, G. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Toward+&#8220;Point+one.">Toward &#8220;Point one.</a> Sci Am. Feb. , 90-95 (1995).</li><li>Appenzeler, T. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=The+Man+Who+Dared+to+Think+Small.">The Man Who Dared to Think Small.</a> Science. 254, 1300-1301 (1991).</li><li>Madou, M. J. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Fundamentals+of+Microfabrications+The+Science+of+Miniaturization.">Fundamentals of Microfabrications The Science of Miniaturization.</a> , (2002).</li><li>Xia, Y., Whitesides, G. M. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Soft+Lithography.">Soft Lithography.</a> Angew Chem Int Ed. 38, 551-575 (1998).</li><li>Judy, J. W. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Microelectromechanical+systems+(MEMS)+fabrication,+design+and+applications.">Microelectromechanical systems (MEMS) fabrication, design and applications.</a> Smart Mater Struct. 10, 1134-1154 (2001).</li><li>Jain, V. K. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=.">.</a> Micromanufacturing Process. , (2012).</li><li>Keum, H., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Silicon+micro-masonry+using+elastomeric+stamps+for+three-dimensional+microfabrication.">Silicon micro-masonry using elastomeric stamps for three-dimensional microfabrication.</a> J Micromech Microeng. 22, 55018 (2012).</li><li>Keum, H., Chung, H., Kim, S. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Electrical+Contact+at+The+Interface+between+Silicon+and+Transfer-Printed+Gold+Films+by+Eutectic+Joining.">Electrical Contact at The Interface between Silicon and Transfer-Printed Gold Films by Eutectic Joining.</a> ACS Appl Mater Interfaces. 5, 6061 (2013).</li><li>Keum, H., Seong, M., Sinha, S., Kim, S. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Electrostatically+Driven+Collapsible+Au+Thin+Films+Assembled+Using+Transfer+Printing+for+Thermal+Switching.">Electrostatically Driven Collapsible Au Thin Films Assembled Using Transfer Printing for Thermal Switching.</a> Appl Phys Lett. 100, 211904 (2012).</li><li>Klaassen, E. H., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Silicon+fusion+bonding+and+deep+reactive+ion+etching:+a+new+technology+for+microstructures.">Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures.</a> Sens Actuators A. 52, 132-139 (1996).</li><li>Barth, P. W. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Silicon+fusion+bonding+for+fabrication+of+sensors+actuators+and+microstructures.">Silicon fusion bonding for fabrication of sensors actuators and microstructures.</a> Sens Actuators. A21 - A23, 919-926 (1990).</li></ol>

The authors have nothing to disclose.

Micro-muratura, illustrato nella figura 4, prevede l&#39;incollaggio fusione di silicio in una fase di saldatura del materiale. Silicon legame di fusione si ottiene ponendo il campione in un forno di ricottura termica rapida (forno RTA) e riscaldamento del campione a 950 ° C per 10 min. Questa condizione di ricottura è sia adottabile tra Si - Si e Si - SiO 2 bonding 10,11. In alternativa, l&#39;Au legato con una striscia di Si come si trova nella Figura 5C adotta...

Sistemi microelettromeccanici (MEMS), come la miniaturizzazione su larga scala macchine 3D ordinarie, sono indispensabili per far progredire le tecnologie moderne, fornendo miglioramenti delle prestazioni e 1,2 di riduzione dei costi di produzione. Tuttavia, l&#39;attuale tasso di progresso tecnologico in MEMS non può essere mantenuta senza continue innovazioni nelle tecnologie di produzione 3-6. Microfabbricazione monolitico comune si basa principalmente su processi layer-by-layer sviluppati per la fabbricazione di circuiti integrati (IC). Questo metodo ha avuto successo a permettere la produzione di massa di dispositivi MEMS ad alte prestazioni. Tuttavia, a causa della sua complessa layer-by-layer e natura elettrochimica sottrattiva, fabbricazione di forma-diversamente strutture e dispositivi MEMS 3D, mentre facile nel macroworld, è molto difficile da realizzare utilizzando questo microfabbricazione monolitico. Per attivare microfabbricazione 3D più flessibile con la complessità meno di processo, ci DEVEluppato una strategia 3D additivo micromanufacturing (chiamato &#39;micro / nano-massoneria&#39;), che coinvolge un gruppo basato su stampa, trasferimento di materiali micro / nanoscala in combinazione con tecniche rapide materiale di incollaggio ricottura abilitato termici. Stampa transfer è un metodo per trasferire materiali solidi microscala (ossia &#39;inchiostri solidi ») da un substrato in cui sono generati o coltivate su un substrato diverso utilizzando adesione secco controllata di Stamp elastomerici. La procedura tipica di micro-muratura inizia con stampa transfer. Inchiostri solidi prefabbricate sono il trasferimento stampato con un timbro microtip che è una forma avanzata di francobolli elastomerici e le strutture stampate sono successivamente ricotto con una rapida ricottura termica (RTA) che permettono di migliorare inchiostro inchiostro e ink-substrato adesione. Questo approccio produttivo consente la costruzione di strutture microscala insoliti e dispositivi che non possono essere ospitati con altre metodologia esistenteds 7. Micro-massoneria fornisce diverse caratteristiche interessanti non presenti in altri metodi: (a) la capacità di integrare inchiostri solidi funzionali e strutturali di materiali dissimili da montare sensori MEMS e attuatori tutto integrato all&#39;interno della struttura 3D; (B) le interfacce di inchiostri solidi assemblati possono funzionare come contatti elettrici e termici 9,10; (C) la risoluzione spaziale assemblaggio può essere elevata (~ 1 micron) utilizzando processi litografici altamente scalabili e di facile comprensione per la generazione di inchiostri solidi e fasi meccaniche altamente precisi per stampa transfer 7; e (d) inchiostri solidi funzionali e strutturali possono essere integrati su entrambi i substrati rigidi e flessibili in planare o geometrie curvilinee.

<table><tbody><tr><td>Az 5214</td><td>Clariant</td><td></td><td>1.5 mm thick Photoresist</td></tr><tr><td>Su8-100</td><td>Microchem</td><td></td><td>100 mm Photoresist used in mold</td></tr><tr><td>Sylgard 184</td><td>Dow Corning</td><td></td><td>PDMS mixed to fabricate stamp</td></tr><tr><td>Hydrofluoric acid</td><td>Honeywell</td><td></td><td>Acid to etch silicon oxide layer</td></tr><tr><td>Silicon on insulator</td><td>Ultrasil</td><td></td><td>Donor substrate was fabricated</td></tr><tr><td>Trichlorosilane</td><td>Sigma-Aldrich</td><td></td><td>Chemical used to help pealing of PDMS from mold</td></tr></tbody></table>

micro-masonry for 3d additive micromanufacturing

Stampa transfer è un metodo per trasferire materiali micro / nanoscala solidi (qui chiamati &quot;inchiostri&quot;) da un substrato in cui sono generati ad un substrato diverso utilizzando Stamp elastomerici. Stampa transfer consente l&#39;integrazione di materiali eterogenei per fabbricare strutture unexampled o sistemi funzionali che si trovano in dispositivi avanzati recenti come celle solari flessibili ed estensibili e array LED. Durante la stampa transfer presenta caratteristiche uniche nella capacità di assemblaggio materiale, l&#39;uso di strati adesivi o la modifica della superficie, come la deposizione di monostrati auto-assemblati (SAM) su substrati per migliorare i processi di stampa ostacola la sua vasta adattamento in microstruttura del sistema microelettromeccanici (MEMS) strutture e dispositivi. Per ovviare a questo inconveniente, abbiamo sviluppato una modalità avanzata di stampa a trasferimento che assembla in modo deterministico oggetti microscala singoli esclusivamente attraverso il controllo superficie di area di contattosenza alcuna alterazione superficiale. L&#39;assenza di uno strato adesivo o altra modificazione e processi materiale legante successive garantire non solo legame meccanico, ma anche il collegamento elettrico e termico tra materiali assemblati, che apre ulteriormente varie applicazioni in adattamento a costruire dispositivi MEMS insoliti.

Micro-massoneria consente l&#39;integrazione di materiale eterogeneo per generare strutture MEMS che sono molto difficili o impossibili da raggiungere da processi di microfabbricazione monolitici. Al fine di dimostrare la sua capacità, una struttura (chiamato &#39;micro teiera&#39;) è realizzato esclusivamente mediante micro-muratura. Figura 4A è un&#39;immagine al microscopio ottico di inchiostri di Si fabbricato su un substrato donatore. Gli inchiostri progettati sono dischi con diverse dimensioni ...

Watch this Scientific Journal Video about Micro-masonry for 3D Additive Micromanufacturing at JoVE.com

Micro-masonry for 3D Additive Micromanufacturing

Questo articolo introduce una strategia 3D additivo micromanufacturing (chiamato &#39;micro-massoneria&#39;) per la fabbricazione flessibile del sistema microelettromeccanici (MEMS) strutture e dispositivi. Questo approccio comporta il trasferimento di montaggio a base di stampa, di materiali micro / nanoscala in combinazione con tecniche rapide materiale di incollaggio ricottura abilitato termici.

Micro-muratura per 3D Additivo Micromanufacturing

Transfer printing is a method to transfer solid micro/nanoscale materials (herein called &#8216;inks&#8217;) from a substrate where they are generated to ...

micro-masonry-for-3d-additive-micromanufacturing

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Masonry

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10.3K Views.  University of Illinois at Urbana-Champaign.  Questo articolo introduce una strategia 3D additivo micromanufacturing (chiamato 'micro-massoneria') per la fabbricazione flessibile del sistema microelettromeccanici (MEMS) strutture e dispositivi. Questo approccio comporta il trasferimento di montaggio a base di stampa, di materiali micro / nanoscala in combinazione con tecniche rapide materiale di incollaggio ricottura abilitato termici. 

Video: Micro-masonry for 3D Additive Micromanufacturing

Manufacturing of Three-dimensionally Microstructured Nanocomposites through Microfluidic Infiltration

Microstructured composite beams reinforced with complex three-dimensionally (3D) patterned nanocomposite microfilaments are fabricated via nanocomposite in&#64257;ltration of 3D interconnected microfluidic networks. The manufacturing of the reinforced beams begins with the fabrication of microfluidic networks, which involves layer-by-layer deposition of fugitive ink filaments using a dispensing robot, filling the empty space between filaments using a low viscosity resin, curing the resin and finally removing the ink.&#160;Self-supported 3D structures with other geometries and many layers (e.g.&#160;a few hundreds layers) could be built using this method. The resulting tubular micro&#64258;uidic networks are then infiltrated with thermosetting nanocomposite suspensions containing nanofillers (e.g.&#160;single-walled carbon nanotubes), and subsequently cured. The infiltration is done by applying a pressure gradient between two ends of the empty network (either by applying a vacuum or vacuum-assisted microinjection). Prior to the infiltration, the nanocomposite suspensions are prepared by dispersing nanofillers into polymer matrices using ultrasonication and three-roll mixing methods. The nanocomposites (i.e.&#160;materials infiltrated) are then solidified under UV exposure/heat cure, resulting in a 3D-reinforced composite structure. The technique presented here enables the design of functional nanocomposite macroscopic products for microengineering applications such as actuators and sensors.

Three-dimensional (3D) microstructured composite beams are fabricated through the directed and localized infiltration of nanocomposites into 3D porous microfluidic networks. The flexibility of this manufacturing method enables the utilization of different thermosetting materials and nanofillers in order to achieve a variety of functional 3D reinforced nanocomposite macroscopic products.

Produzione di tridimensionalmente microstrutturate nanocompositi attraverso Microfluidic Infiltration

Microstructured composite beams reinforced with complex three-dimensionally (3D) patterned nanocomposite microfilaments are fabricated via nanocomposite ...

Ricerca

Chimica

Microfabrication of Chip-sized Scaffolds for Three-dimensional Cell cultivation

Using microfabrication technologies is a prerequisite to create scaffolds of reproducible geometry and constant quality for three-dimensional cell cultivation. These technologies offer a wide spectrum of advantages not only for manufacturing but also for different applications. The size and shape of formed cell clusters can be influenced by the exact and reproducible architecture of the microfabricated scaffold and, therefore, the diffusion path length of nutrients and gases can be controlled.1 This is unquestionably a useful tool to prevent apoptosis and necrosis of cells due to an insufficient nutrient and gas supply or removal of cellular metabolites.
Our polymer chip, called CellChip, has the outer dimensions of 2 x 2 cm with a central microstructured area. This area is subdivided into an array of up to 1156 microcontainers with a typical dimension of 300 m edge length for the cubic design (cp- or cf-chip) or of 300 m diameter and depth for the round design (r-chip).2
So far, hot embossing or micro injection moulding (in combination with subsequent laborious machining of the parts) was used for the fabrication of the microstructured chips. Basically, micro injection moulding is one of the only polymer based replication techniques that, up to now, is capable for mass production of polymer microstructures.3 However, both techniques have certain unwanted limitations due to the processing of a viscous polymer melt with the generation of very thin walls or integrated through holes. In case of the CellChip, thin bottom layers are necessary to perforate the polymer and provide small pores of defined size to supply cells with culture medium e.g. by microfluidic perfusion of the containers.
In order to overcome these limitations and to reduce the manufacturing costs we have developed a new microtechnical approach on the basis of a down-scaled thermoforming process. For the manufacturing of highly porous and thin walled polymer chips, we use a combination of heavy ion irradiation, microthermoforming and track etching. In this so called "SMART" process (Substrate Modification And Replication by Thermoforming) thin polymer films are irradiated with energetic heavy projectiles of several hundred MeV introducing so-called "latent tracks" Subsequently, the film in a rubber elastic state is formed into three dimensional parts without modifying or annealing the tracks. After the forming process, selective chemical etching finally converts the tracks into cylindrical pores of adjustable diameter.

We present two processes for the microfabrication of porous polymer chips for three-dimensional cell cultivation. The first one is hot embossing combined with a solvent vapour welding process. The second one uses a recently developed microthermoforming process combined with ion track technology leading to a significant simplification of manufacture.

Microfabbricazione di chip di dimensioni Ponteggi per tridimensionale coltura cellulare

Using microfabrication technologies is a prerequisite to create scaffolds of reproducible geometry and constant quality for three-dimensional cell ...

Biologia

A Soft Tooling Process Chain for Injection Molding of a 3D Component with Micro Pillars

The purpose of this paper is to present the method of a soft tooling process chain employing Additive Manufacturing (AM) for fabrication of injection molding inserts with micro surface features. The Soft Tooling inserts are manufactured by Digital Light Processing (vat photo polymerization) using a photopolymer that can withstand relatively high temperaturea. The part manufactured here has four tines with an angle of 60&#176;. Micro pillars (&#216;200 &#181;m, aspect ratio of 1) are arranged on the surfaces by two rows. Polyethylene (PE) injection molding with the soft tooling inserts is used to fabricate the final parts. This method demonstrates that it is feasible to obtain injection-molded parts with microstructures on complex geometry by additive manufactured inserts. The machining time and cost is reduced significantly compared to conventional tooling processes based on computer numerical control (CNC) machining. The dimensions of the micro features are influenced by the applied additive manufacturing process. The lifetime of the inserts determines that this process is more suitable for pilot production. The precision of the inserts production is limited by the additive manufacturing process as well.

A protocol for fabricating injection molding inserts for complex geometry with micro features on surfaces employing Additive Manufacturing (AM) is presented.

Una catena di processo utensili morbido per lo stampaggio di un componente 3D con Micro pilastri

The purpose of this paper is to present the method of a soft tooling process chain employing Additive Manufacturing (AM) for fabrication of injection ...

Ingegneria

Multi-material Ceramic-Based Components &#8211; Additive Manufacturing of Black-and-white Zirconia Components by Thermoplastic 3D-Printing (CerAM - T3DP)

To combine the benefits of Additive Manufacturing (AM) with the benefits of Functionally Graded Materials (FGM) to ceramic-based 4D components (three dimensions for the geometry and one degree of freedom concerning the material properties at each position) the Thermoplastic 3D-Printing (CerAM -&#160;T3DP) was developed. It is a direct AM technology which allows the AM of multi-material components. To demonstrate the advantages of this technology black-and-white zirconia components were additively manufactured and co-sintered defect-free.
Two different pairs of black and white zirconia powders were used to prepare different thermoplastic suspensions. Appropriate dispensing parameters were investigated to manufacture single-material test components and adjusted for the additive manufacturing of multi-color zirconia components.

Here we describe a protocol for additively manufacturing black-and-white zirconia components by Thermoplastic 3D-Printing (CerAM -&#160;T3DP) and co-sintering defect-free.

Componenti ceramici multi-materiali – additivo produzione di componenti di Zirconia in bianco e nero di stampa 3D termoplastico (CerAM - T3DP)

To combine the benefits of Additive Manufacturing (AM) with the benefits of Functionally Graded Materials (FGM) to ceramic-based 4D components (three ...

Additive Manufacturing of Functionally Graded Ceramic Materials by Stereolithography

An additive manufacturing technology is applied to obtain functionally graded ceramic parts. This technology, based on digital light processing/stereolithography, is developed within the scope of the CerAMfacturing European research project. A three-dimensional (3-D) hemi-maxillary bone-like structure is 3-D printed using custom aluminum oxide polymeric mixtures. The powders and mixtures are fully analyzed in terms of rheological behavior in order to ensure proper material handling during the printing process. The possibility to print functionally graded materials using the Admaflex technology is explained in this document. Field-emission scanning electron microscopy (FESEM) show that the sintered aluminum oxide ceramic part has a porosity lower than 1% and no remainder of the original layered structure is found after analysis.

This manuscript describes the processing of single multifunctional ceramic components (e.g., combinations of dense-porous structures) additively manufactured by stereolithography.

Produzione di additivi di materiali ceramici funzionalmente graduate di stereolitografia

An additive manufacturing technology is applied to obtain functionally graded ceramic parts. This technology, based on digital light ...

Negative Additive Manufacturing of Complex Shaped Boron Carbides

Boron carbide (B4C) is one of the hardest materials in existence. However, this attractive property also limits its machineability into complex shapes for high wear, high hardness, and lightweight material applications such as armors. To overcome this challenge, negative additive manufacturing (AM) is employed to produce complex geometries of boron carbides at various length scales. Negative AM first involves gelcasting a suspension into a 3D-printed plastic mold. The mold is then dissolved away, leaving behind a green body as a negative copy. Resorcinol-formaldehyde (RF) is used as a novel gelling agent because unlike traditional hydrogels, there is little to no shrinkage, which allows for extremely complex molds to be used. Furthermore, this gelling agent can be pyrolyzed to leave behind ~50 wt% carbon, which is a highly effective sintering aid for B4C. Due to this highly homogenous distribution of in situ carbon within the B4C matrix, less than 2% porosity can be achieved after sintering. This protocol highlights in detail the methodology for creating near fully dense boron carbide parts with highly complex geometries.

A method called negative additive manufacturing is used to produce near fully dense complex shaped boron carbide parts of various length scales. This technique is possible via the formulation of a novel suspension involving resorcinol-formaldehyde as a unique gelling agent that leaves behind a homogenous carbon sintering aid after pyrolysis.

Produzione additiva negativa del complesso a forma di carburi di boro

Boron carbide (B4C) is one of the hardest materials in existence. However, this attractive property also limits its machineability into complex shapes for ...

Micropatterning and Assembly of 3D Microvessels

In vitro platforms to study endothelial cells and vascular biology are largely limited to 2D endothelial cell culture, flow chambers with polymer or glass based substrates, and hydrogel-based tube formation assays. These assays, while informative, do not recapitulate lumen geometry, proper extracellular matrix, and multi-cellular proximity, which play key roles in modulating vascular function. This manuscript describes an injection molding method to generate engineered vessels with diameters on the order of 100 &#181;m. Microvessels are fabricated by seeding endothelial cells in a microfluidic channel embedded within a native type I collagen hydrogel. By incorporating parenchymal cells within the collagen matrix prior to channel formation, specific tissue microenvironments can be modeled and studied. Additional modulations of hydrodynamic properties and media composition allow for control of complex vascular function within the desired microenvironment. This platform allows for the study of perivascular cell recruitment, blood-endothelium interactions, flow response, and tissue-microvascular interactions. Engineered microvessels offer the ability to isolate the influence from individual components of a vascular niche and precisely control its chemical, mechanical, and biological properties to study vascular biology in both health and disease.

This manuscript presents an injection molding method to engineer microvessels that recapitulate physiological properties of endothelium. The microfluidic-based process creates patent 3D vascular networks with tailorable conditions, such as flow, cellular composition, geometry, and biochemical gradients. The fabrication process and examples of potential applications are described.

Micropatterning e montaggio dei microvasi 3D

In vitro platforms to study endothelial cells and vascular biology are largely limited to 2D endothelial cell culture, flow chambers with polymer or glass ...

Bioingegneria

Design and Development of a Three-Dimensionally Printed Microscope Mask Alignment Adapter for the Fabrication of Multilayer Microfluidic Devices

This project aims to develop an easy-to-use and cost-effective platform for the fabrication of precise, multilayer microfluidic devices, which typically can only be achieved using costly equipment in a clean room setting. The key part of the platform is a three dimensionally (3D) printed microscope mask alignment adapter (MMAA) compatible with regular optical microscopes and ultraviolet (UV) light exposure systems. The overall process of creating the device has been vastly simplified because of the work done to optimize the device design. The process entails finding the proper dimensions for the equipment available in the laboratory and 3D-printing the MMAA with the optimized specifications. Experimental results show that the optimized MMAA designed and manufactured by 3D printing performs well with a common microscope and light exposure system. Using a master mold prepared by the 3D-printed MMAA, the resulting microfluidic devices with multilayered structures contain alignment errors of &lt;10 &#181;m, which is sufficient for common microchips. Although human error through transportation of the device to the UV light exposure system can cause larger fabrication errors, the minimal errors achieved in this study are attainable with practice and care. Furthermore, the MMAA can be customized to fit any microscope and UV exposure system by making changes to the modeling file in the 3D printing system. This project provides smaller laboratories with a useful research tool as it only requires the use of equipment that is typically already available to laboratories that produce and use microfluidic devices. The following detailed protocol outlines the design and 3D printing process for the MMAA. In addition, the steps for procuring a multilayer master mold using the MMAA and producing poly(dimethylsiloxane) (PDMS) microfluidic chips is also described herein.

This project allows small laboratories to develop an easy-to-use platform for the fabrication of precise multilayer microfluidic devices. The platform consists of a three-dimensionally printed microscope mask alignment adapter using which multilayer microfluidic devices with alignment errors of &lt;10 &#181;m were achieved.

Progettazione e sviluppo di un adattatore di allineamento della maschera per microscopio stampato tridimensionalmente per la fabbricazione di dispositivi microfluidici multistrato

This project aims to develop an easy-to-use and cost-effective platform for the fabrication of precise, multilayer microfluidic devices, which typically ...

Computer Numerical Control Micromilling of a Microfluidic Acrylic Device with a Staggered Restriction for Magnetic Nanoparticle-Based Immunoassays

Microfluidic systems have greatly improved immunoassay techniques. However, many microfabrication techniques require specialized, expensive, or complicated equipment, making fabrication costly and incompatible with mass production, which is one of the most important preconditions for point-of-care tests (POCT) to be adopted in low-resource settings. This work describes the fabrication process of an acrylic (polymethylmethacrylate, PMMA) device for nanoparticle-conjugated enzymatic immunoassay testing using the computer numerical control (CNC) micromilling technique. The functioning of the microfluidic device is shown by performing an immunoassay to detect a commercial antibody using lysozyme as a model antigen conjugated to 100 nm magnetic nanoparticles. This device integrates a physical staggered restriction of only 5 &#181;m in height, used to capture magnetic microparticles that make up a magnetic trap by placing an external magnet. In this way, the magnetic force on the immunosupport of conjugated nanoparticles is enough to capture them and resist flow drag. This microfluidic device is particularly suitable for low-cost mass production without the loss of precision for immunoassay performance.

Microfluidics is a powerful tool for the development of diagnostic tests. However, expensive equipment and materials, as well as laborious fabrication and handling techniques, are often required. Here, we detail the fabrication protocol of an acrylic microfluidic device for magnetic micro- and nanoparticle-based immunoassays in a low-cost and simple-to-use setting.

Microfresatura a controllo numerico computerizzato di un dispositivo acrilico microfluidico con restrizione sfalsata per saggi immunologici magnetici basati su nanoparticelle

Microfluidic systems have greatly improved immunoassay techniques. However, many microfabrication techniques require specialized, expensive, or ...

An Additive Manufacturing Technique for the Facile and Rapid Fabrication of Hydrogel-based Micromachines with Magnetically Responsive Components

Polyethylene glycol (PEG)-based hydrogels are biocompatible hydrogels that have been approved for use in humans by the FDA. Typical PEG-based hydrogels have simple monolithic architectures and often function as scaffolding materials for tissue engineering applications. More sophisticated structures typically take a long time to fabricate and do not contain moving components. This protocol describes a photolithography method that allows for facile and rapid microfabrication of PEG structures and devices. This strategy involves an in-house developed fabrication stage that allows for the rapid fabrication of 3D structures by building upwards in a layer-by-layer fashion. Independent moving components can also be aligned and assembled onto support structures to form integrated devices. These independent components are doped with superparamagnetic iron oxide nanoparticles that are sensitive to magnetic actuation. In this manner, the fabricated devices can be actuated using external magnets to yield movement of the components within. Hence, this technique allows for the fabrication of sophisticated MEMS-like devices (micromachines) that are composed entirely out of a biocompatible hydrogel, able to function without an onboard power source, and respond to a contact-less method of actuation. This manuscript describes the fabrication of both the fabrication set-up as well as the step-by-step method for the microfabrication of these hydrogels-based MEMS-like devices.

An additive manufacturing strategy for processing UV-crosslinkable hydrogels has been developed. This strategy allows for the layer-by-layer assembly of microfabricated hydrogel structures as well as the assembly of independent components, yielding integrated devices containing moving components that are responsive to magnetic actuation.

Un additivo tecnica di fabbricazione per la Facile e rapida realizzazione di Micromachines base di idrogel con componenti magneticamente reattivi

Polyethylene glycol (PEG)-based hydrogels are biocompatible hydrogels that have been approved for use in humans by the FDA. Typical PEG-based hydrogels ...