This work was funded by the Office of Naval Research (ONR) through the Naval Research Laboratory Basic Research Program.

1.使供体基体<ol><li>掩模用胶带留下未覆盖的玻璃的中心区域的玻璃载片的边缘。 </li><li>浸没在缓冲的HF的滑动件（6:在水中的水1的比例为40％的NH 4 F到48％HF）的为3-15分钟。注意:这将蚀刻是未屏蔽的幻灯片的中心，形成一个好。应该是很好的深度1和5微米之间，这可以通过触笔轮廓或原子力显微镜使用制造商的指令来确定。 </li><li>取下胶带面膜。 </li></ol> 2.创建色带<ol><li>在井的一侧传播Ag膏的量小。确保有足够填补好了，大致10毫克范围内。这是没有必要然而，第一测量量。 </li><li>牢牢拖动的直金属刀片穿过井，铺展糊在其整体的薄层。均匀地分布膏没有任何薄斑点。 THI的终产物S程序 - 小以及含Ag墨 - 被称为"丝带"。 </li><li>擦去了井外流传着一个实验室擦去粘贴。 </li></ol> 3.烘干功能区<ol><li>放置在一个低湿度环境色带面朝上。充满干燥氮气的盒子效果最好。 </li><li>离开丝带在室温下至少2小时。在这一点上，墨水粘度应当足够高，以进行打印。 注意:充分干燥之后，墨带可以通过将在另一载玻片阱面朝下，并将其存储在干氮气环境下储存大约一个月。一旦以这种方式存储，它是好的离开墨带无人为长时间。 </li></ol> 4.印刷体素<ol><li>接收基板附着到使用真空卡盘或双面胶带的XY平移阶段。注意:接收基板必须是平坦的，但是没有其他的限制。硅晶片，GL屁股幻灯片，或200℃的相容性聚合物都可以接受的接收器基板。 </li><li>放置在接收器衬底上的墨带面朝下。 </li><li>聚焦光学装置通过施主衬底的背面，上井内的油墨的背面。 注意:有许多方法来安排这个过程的光学，但以下步骤/组件是必要的: <ol><li>使用脉冲UV激光具有"顶帽"的空间能量分布（相对于高斯）的光束。使用能够可控地烧成各脉冲，这可能需要一个声 - 光调制器的激光器。声光调制器，用户可以控制各脉冲的击发。 </li><li>通过孔传递光束，成形的光束的横截面成所需的形状。注意，孔的形状决定了体素的形状。也就是说，孔基本上成像到施主衬底，类似于马斯ķ投影。 </li><li>使用显微镜物镜以减小光束截面，它决定了印刷体素的尺寸的大小。例如，如果一个10X物镜产量方体素为50微米的横向尺寸，那么50X物镜将打印相同的形状（正方形）与10微米的横向尺寸的体素。 </li><li>将带有微观目标一致（通过分光器），一台摄像机。这使得墨带的主动监测。 </li></ol></li><li>火单个激光脉冲到供体基板。为激光能量密度合理的起始值是在40-60毫焦耳/厘米2的范围内。确保有在将体素被喷出的激光束的横截面的形状的可见的孔。如果孔是不可见的，有几个可能的原因: <ol><li>失焦。 <ol><li>调整聚焦物镜的高度。这可能会带来孔成为关注的焦点。 </li></ol></li><li>低能量。 <ol><li>慢慢地INCrease激光高达60-80毫焦耳/ cm 2的注量的能量。较厚的色带，可能需要较高的能量密度值。 </li></ol></li><li>油墨的粘度太低。 <ol><li>如果体素被喷射，但在墨带的孔立即重新填充，则油墨粘度仍然太低，因此干燥基于在步骤3中的指示另一个30分钟的色带，然后再次开始步骤4。 </li></ol></li></ol></li><li>移动的XY平移阶段沿X和Y轴，以一个新的斑点。 </li><li>再次触发单个激光脉冲到所述施主衬底，喷射体素和离开尖锐定义的孔，其中体素被从墨带喷射。 </li></ol> 5.打印复杂的结构<ol><li>创建由以下方式相邻体素联系在一起行 : <ol><li>如在4.1-4.4所述转移体素。 </li><li>移动的XY平移阶段一个体素长度沿X或Y方向。 </li><li>如在4.1-4.4所述转移体素。 </li><li>直到获得足够长的线路重复此过程。 </li></ol></li><li>创建以下列方式桥接或悬臂结构: <ol><li>对准光束，使得被排出的体素将弥合施主衬底上的几何间隙或使得所述体素的一部分将伸出过去的几何间隙的边缘。 </li><li>如在4.1-4.4所述转移体素。注意:如果浆料粘度太低，体素可以符合功能它下面，而不是创建桥或悬臂。 </li></ol></li><li>创建以下列方式高纵横比结构: <ol><li>如在4.1-4.4所述转移体素。 </li><li>无需移动接收基板，该供体基板移动到色带新鲜斑点。 </li><li>如在4.1-4.4所述转移体素。 </li><li>重复步骤5.3.2和5.3.3，直到有足够喜的一个特征获得GHT。如果结构是建立比〜3-5微米高，周期性地插入供体和接收基板之间的间隔，以使体素栈和墨带不会直接接触。需要注意的是光学将需要按第4.4.1节中描述来解释捐助基板高度的变化进行重新调整。 </li></ol></li></ol> 6.印刷通过DMD芯片的复杂图像<ol><li>绘制或上传所需的体素形状的图像。确保图像文件的格式是一个位图。注意:这是至关重要的使用光学系统的的缩小因子来缩放绘图到体素的大小进行打印。在DMD基本上替换这样的孔，而不是梁本质上是成像掩模投影，微型镜阵列被用来塑造光束。 </li><li>选择合适的激光（UV或绿色）。 </li><li>打开DMD并打开DMD软件。 <ol><li>点击"打开图像"和负载位patteRN。选择负载和复位。 </li><li>点击"添加"。位图文件的名称应该出现在右侧面板中。 </li><li>点击"运行一次"。现在装到DMD位图模式。 </li></ol></li><li>安排捐赠者和接收者基材如步骤4.1到4.3概述。如步骤4.4到4.6概述传墨。 </li><li>一旦转让成功，如果需要的话重复步骤6.3至6.4;然后进行第7步。 </li></ol> 7.炉一旦所有的体素都印，治愈他们在炉。 <ol><li>放置在炉中的接收基板面朝上。 </li><li>离开在180℃固化2小时。 </li></ol>

<ol>
	<li>Park, J. U., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=High-resolution+electrohydrodynamic+jet+printing.">High-resolution electrohydrodynamic jet printing.</a> Nature Mater. 6, 782-789 (2007).</li><li>Hon, K. K. B., Li, L., Hutchings, I. M. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Direct+writing+technology+-+Advances+and+developments.">Direct writing technology - Advances and developments.</a> CIRP Ann. 57, 601-620 (2008).</li><li>Calvert, P. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Inkjet+Printing+for+Materials+and+Devices.">Inkjet Printing for Materials and Devices.</a> Chem. Mater. 13, 3299-3305 (2001).</li><li>Arnold, C. B., Serra, P., Piqu&#233;, A. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Laser+direct-write+techniques+for+printing+of+complex+materials.">Laser direct-write techniques for printing of complex materials.</a> MRS Bulletin. 32, 23-31 (2007).</li><li>Park, J. U., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=High-resolution+electrohydrodynamic+jet+printing.">High-resolution electrohydrodynamic jet printing.</a> Nature Mater. 6, 782-789 (2007).</li><li>Hon, K. K. B., Li, L., Hutchings, I. M. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Direct+writing+technology+-+Advances+and+developments.">Direct writing technology - Advances and developments.</a> CIRP Ann. 57, 601-620 (2008).</li><li>Calvert, P. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Inkjet+Printing+for+Materials+and+Devices.">Inkjet Printing for Materials and Devices.</a> Chem. Mater. 13, 3299-3305 (2001).</li><li>Arnold, C. B., Serra, P., Piqu&#233;, A. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Laser+direct-write+techniques+for+printing+of+complex+materials.">Laser direct-write techniques for printing of complex materials.</a> MRS Bulletin. 32, 23-31 (2007).</li><li>Piqu&#233;, A., Auyeung, R. C. Y., Kim, H. K., Metkus, M., Mathews, S. A. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Digital+microfabrication+by+laser+decal+transfer.">Digital microfabrication by laser decal transfer.</a> J. Laser. Micro. Nanoeng. 3, 163-168 (2008).</li><li>Auyeung, R. C. Y., Kim, H., Birnbaum, A. J., Zalalutdinov, M., Mathews, S. A., Piqu&#233;, A. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Laser+decal+transfer+of+freestanding+microcantilevers+and+microbridges.">Laser decal transfer of freestanding microcantilevers and microbridges.</a> Appl. Phys. A. 97, 513-519 (2009).</li><li>Kim, H., Melinger, J. S., Khachatrian, A., Charipar, N. A., Auyeung, R. C. Y., Piqu&#233;, A. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Fabrication+of+terahertz+metamaterials+by+laser+printing.">Fabrication of terahertz metamaterials by laser printing.</a> Opt. Lett. 35, 4039-4041 (2010).</li><li>Wang, J., Auyeung, R. C. Y., Kim, H., Charipar, N. A., Piqu&#233;, A. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Three-dimensional+printing+of+interconnects+by+laser+direct-write+of+silver+nanopastes.">Three-dimensional printing of interconnects by laser direct-write of silver nanopastes.</a> Adv. Mater. 22, 4462-4466 (2010).</li><li>Mathews, S. A., Auyeung, R. C. Y., Kim, H., Charipar, N. A., Piqu&#233;, A. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=High-speed+video+study+of+laser-induced+forward+transfer+of+silver+nano-suspensions.">High-speed video study of laser-induced forward transfer of silver nano-suspensions.</a> J. Appl. Phys. 114, 064910 (2013).</li><li>King, B. H., Dimos, D., Yang, P., Morissette, S. L. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Direct-write+fabrication+of+integrated,+multilayer+ceramic+components.">Direct-write fabrication of integrated, multilayer ceramic components.</a> J. Electroceram. 3, 173-178 (1999).</li><li>Lewis, J. A. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Direct+ink+writing+of+3D+functional+materials.">Direct ink writing of 3D functional materials.</a> Adv. Funct. Mater. 16, 2193-2204 (2006).</li><li>Calvert, P. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Inkjet+printing+for+materials+and+devices.">Inkjet printing for materials and devices.</a> Chem. Mater. 13, 3299-3305 (2001).</li><li>Kang, H., Soltman, D., Subramanian, V. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Hydrostatic+Optimization+of+Inkjet-Printed+Films.">Hydrostatic Optimization of Inkjet-Printed Films.</a> Langmuir. 26, 11568-11573 (2010).</li><li>Piqu&#233;, A., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Laser+decal+transfer+of+electronic+materials+with+thin+film+characteristics.">Laser decal transfer of electronic materials with thin film characteristics.</a> Proc. SPIE. 6879, 687911 (2008).</li><li>Auyeung, R. C. Y., Kim, H., Birnbaum, A. J., Zalalutdinov, M., Mathews, S. A., Piqu&#233;, A. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Laser+decal+transfer+of+freestanding+microcantilevers+and+microbridges.">Laser decal transfer of freestanding microcantilevers and microbridges.</a> Appl. Phys. A: Mater. Sci. Process. 97, 513-519 (2009).</li><li>Soltman, D., Smith, V., Kang, H., Morris, S. J. S., Subramanian, V. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Methodology+for+inkjet+printing+of+partially+wetting+films.">Methodology for inkjet printing of partially wetting films.</a> Langmuir. 26, 15686-15693 (2010).</li><li>Auyeung, R. C. Y., Kim, H., Charipar, N., Birnbaum, A., Mathews, S., Piqu&#233;, A. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Laser+forward+transfer+based+on+a+spatial+light+modulator.">Laser forward transfer based on a spatial light modulator.</a> Appl. Phys. A: Mater. Sci. Process. 102, 21-26 (2011).</li><li>Duocastella, M., Fernandez-Pradas, J. M., Serra, P., Morenza, J. L. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Jet+formation+in+the+laser+forward+transfer+of+liquids.">Jet formation in the laser forward transfer of liquids.</a> Appl. Phys. A: Mater. Sci. Process. 93, 453-456 (2008).</li><li>Feinaueugle, M., Alloncle, A. P., Delaporte, P., Sones, C. L., Eason, R. W. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Time-resolved+shadowgraph+imaging+of+femtosecond+laser-induced+forward+transfer+of+solid+materials.">Time-resolved shadowgraph imaging of femtosecond laser-induced forward transfer of solid materials.</a> Appl. Surf. Science. 258, 8475-8483 (2012).</li><li>Breckenfeld, E., Kim, H., Auyeung, R. C. Y., Charipar, N., Serra, P., Piqu&#233;, A. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Laser-induced+forward+transfer+of+silver+nanopaste+for+microwave+interconnects,+A.">Laser-induced forward transfer of silver nanopaste for microwave interconnects, A.</a> Appl. Surf. Science. 331, 254-261 (2015).</li></ol>

作者什么都没有透露。

在本文中，我们已经证明了高粘度的Ag纳米糊的非接触式，立体印刷以及单激光拍，大面积的印刷（通过DMD芯片）的步骤。不像其他直接写入技术，如喷墨，这里描述的LDT技术允许复杂的体素形状的一个激光脉冲， 即印刷，在一个单一的步骤。而该过程的许多方面看似简单，存在需要以优化迭代测试多个步骤。首先，浆料干燥和粘度是成功转移的最重要因素。虽然这些点已经被一再文本强调的，我们在这里重申点强调的重要性。如果油墨的粘度太低，那么这将是不可能的打印尖锐，明确界定的体素的形状。试图弹出体素时，会发生警示信号，该油墨的粘度太低。当激光脉冲触发时，素会出现瞬间弹出，但油墨会留在供体基板孔填快速反击。在这种情况下，用户应停止发射激光和油墨应进一步视为在步骤3.1和3.2中概述。如果油墨的粘度太高，体素转印过程中会出现的成功的色带。但是，检查接收基板上的体素时，会出现显著撕裂，压裂，或碎屑。在这种情况下，用户需要处置当前色带的和使一个新的色带作为第2墨液的粘度和干燥时间的优化概述应通过评估体素传递尝试的质量来完成。我们建议不要试图测量所述浆料的粘度在任何点。第二，激光注量几乎是一样的油墨的粘度和在注量非常小的变化的重要可对处理的显著效果。它应该是很清楚的，当能量太低 - 体素不会从施主衬底弹出。建议首先在步骤4.4所建议的能量密度范围，然后很逐渐增加的价值。导致在一个完整的传输的最低能量被称为"阈值注量"。通常最好在或接近阈通量操作，因为较高的能量密度值将趋于破裂或撕裂的体素。最后，这取决于多种激光用于的过程中，有可能是在激光轮廓的热点。这可能需要光圈的调整采样束的更均匀的区域。如果喷射的体素的形状翘曲或很差的光束横截面的形状匹配，激光热点或油墨层厚度或均匀性可以负责。 除了故障排除，也有该技术有一些限制。最后炉固化步骤使得难以或不可能实现与非高叔所需功能性质的体素emperature兼容基板。通常，在该手稿中使用的银纳米糊膏，需要以获得合理的电导率值至少为150℃的固化温度。需要在施主衬底上的油墨层的制造被进一步优化，以提高厚薄均匀，面积覆盖率和处理时间。墨层厚度对阈注量和传输质量，和非均匀厚度的显着的效果可以使传输过程困难，转印体素超过20微米×20微米的较小时尤其如此。当前设计为施主衬底使得难以建立较厘米，这限制了大面积的吞吐量的10秒较大丝带。因此，备用施主衬底的设计，如卷到卷轴或旋转盘的发展，将需要提高自动化和较大面积的处理。 在LDT技术的优势在于具有高传输流体的能力粘度的其它滴按需技术不能处理。 LDT的优点可以被分离成，其中首先，印刷中的高粘度糊料在质量提供了一个改善或加速过印刷的低粘度浆料，其次，在其中具有高粘度糊料印刷，可允许不低粘度打印访问的结构的情况两种情况。在第一类的优点的实例是:从润湿作用，在固化过程中高度过度体素的形状和大小，最小的收缩的控制，以及低激光能量最小体素的变异相比其他LIFT进程（以及因此低传输速度）。在第二类的实例是:高纵横比结构的印刷，桥接结构，悬臂，而且需要有良好的体素的形状保持的任何其它结构。由LDT过程与DMD芯片结合，复杂的形状和图案的并行打印被启用，它大大加快了整个过程。此外，T他使​​用一个DMD的塑造的体素可以设计到激光脉冲之间进行更新，从而使动态重新配置的体素的快速打印。一般来说，在DMD（33千赫）的刷新速率比激光（100千赫兹或更高）的最大重复率稍微慢一些，但限制因素为打印速度的速率是舞台翻译。 用于与LDT系统地位的主要途径的额外材料的持续发展，提高了织带的制造过程中，并继续扩大通过集成数字光处理（DLP）技术，如DMD芯片的过程。虽然金属和绝缘材料通过这一过程被成功地转移，很少活性材料已经被开发。打印压电式，磁或光电材料与工艺LDT可以打开巨大的技术可能性的能力。因为它代表，捐助SUBST几何速率限制的可扩展性。的卷到卷轴或旋转盘施主衬底开发将大大简化流程。最后，DLP技术的LDT的组合是用于数字化制造领域的潜在破坏性的发展，把先前串行处理成具有高度并行处理。实现这一目标的一个关键挑战是在多尺度打印好的特征分辨率体素的能力。这就是说，用10秒或100秒的1-5微米的量级含有微米特征的量级上的横向尺寸的体素。总之，这些发展提供大面积的添加剂制造的电子元器件显著的机会。

添加剂的印刷技术是用于功能性材料的图案形成相当大的兴趣到各种基材的。这些所谓的"直写"过程，包括micropen 10，直接写入组件11，喷墨12，和升降机4，是非常适合的各种特征尺寸范围从亚微米到宏观1,2的制造。这些技术的主要优点是成本低，环境友好，并从概念到原型快速周转。实际上，快速成型为这样的处理的主要用途。由这些方法所用的材料通常是由在溶剂中的纳米粒子悬浮液，并且通常需要一个炉中，以实现其功能特性沉积后固化步骤。虽然micropen和直接写入组件是实现相对简单，既依赖于与接收衬底的连续长丝接触分配期间。虽然喷墨是一个简单的，非接触直接写入方法，它通常仅限于低粘度，化学良性纳米颗粒悬浮液的转移，以避免在分配喷嘴的堵塞和​​/或腐蚀。此外，通过喷墨具有良好定义的边缘特征的印刷图案赋予不同的表面和其产生的不稳定性的流体由于润湿作用13可变的行为是非常困难的。无论如何，喷墨迄今享有研究者最受关注。 升降机，另一方面，是一种非接触式，无喷嘴添加法，其能够传送高粘度浆料与边缘精确定义的。在这个过程中，复合材料的受控量是从施主衬底（或"色带"），通过使用激光脉冲4如在图1示意性示出转移到接收衬底。当使用高粘度浆料，它是硅氧烷IBLE在印制体素相匹配的入射激光脉冲的横截面5的尺寸和形状。该方法已被称为激光贴花转印（LDT），并提供到直写，其中体素的形状和尺寸易于控制的参数的独特的方法，使结构的非光刻生成用于范围广泛的应用，如电路维修14，超材料7，8互连，和独立结构15。在一个传送步骤沉积复杂形状的能力大大降低了处理时间，并避免与多个个体素，在大多数数字印刷技术的共同问题的合并问题。动态地调整各激光脉冲17的空间分布的能力用于增加LDT的写入速度比其它激光直写（LDW）技术。作为这些加工优势的结果，我们指的是LDT过程作为是"部分并行"，因为它允许多个串行编程步骤组合成一个平行的。并行化的程度，最终取决于迅速改变激光横截面轮廓的能力，因此，所得到的体素的形状，并在由该色带和衬底可以被翻译的速度。 以帮助观察的过程中，材料的过程中LIFT过程的行为是在图2A，2C和2E示意性地描绘了三种不同的糊的粘度。对于低粘度的油墨 （ 图2A）9，转印过程如下喷射行为，导致圆形，半球形的体素（ 图2B）的形成18。 图2C示出了非常高的粘度的悬浮液转移，其中，所述喷射体素经历类似什么是不成用这样LIFT观察盖陶瓷层19。 图2E示出了纳米糊膏与合适的，中间的粘度，其中被释放的体素是不受形状由于表面张力作用变形并到达接收衬底完好的LDT传输。粘度对被转印体素的形状的影响示于图2B，2D和2F的原子力显微镜（AFM）图像。 如图2F所示，也能够获得清晰的，明确界定的体素对的粘度在适当的范围，通常是约100帕·秒为银纳米糊膏5。 总体来看，已经出现了与用于微米分辨率的三维结构的潜力相结合的非接触印刷方法的报道很少。该方法LDT提供能够与超细间距结合能力制造互连的自由进程。许多应用，包括精密的电子器件，有机电子和微机电系统（MEMS）可受益于这样的方法。在这里，我们证明了高粘度的Ag纳米糊的非接触式，立体印刷以及单激光拍，大面积的印刷（通过DMD芯片）的步骤。

<table><tbody><tr><td>Silver Nano-paste for Screen Printing</td><td>Harima Chemicals Group, http://www.harima.co.jp/en/</td><td>NPS Type HP</td><td>Store at 10 &amp;#176;C, do not allow to freeze; before using, wait 1 hour for paste to reach room temperature.</td></tr><tr><td>Buffered HF Solution</td><td>http://transene.com/sio2/</td><td>BUFFER HF IMPROVED</td><td>Etch rate may vary depending on material structure</td></tr></tbody></table>

laser-induced forward transfer of ag nanopaste

在过去的十年中，出现了非光刻方法1-3印刷金属油墨或其他功能材料长足的发展。许多这样的过程，如喷墨3和激光诱导向前转移（LIFT）4已经成为在可印刷电子和无掩模图形化的兴趣日益流行的不断壮大。这些添加剂的制造工艺是便宜的，环境友好的，并非常适合用于快速原型相比，更传统的半导体加工技术时。虽然大多数的直接写入过程被限制到两维结构，并且不能处理高粘度（特别是喷墨）材料，如果进行适当的升降可以超越两个约束。的三维像素（称为体素），也被称为激光贴花转印（LDT）5-9全等转移，最近已经证明，使用高度粘稠的Ag nanopast电梯技术下载到制造独立的互连，复杂的体素形状和高宽比的结构。在本文中，我们展示了用于制造各种微观和宏观的Ag结构的简单而通用的过程。结构包括用市售数字微镜器件（DMD）芯片用于图案化电触点简单的形状，桥接和悬臂结构，高宽比的结构，和单次，面积大的传输。

图3示出了具有在其中心的孔的代表性供体基板。标准载玻片用于施主衬底和阱的在这种情况下的深度为1微米。请注意，所有的银纳米糊膏的仅限于矩形孔和基板的其余部分是干净的。同样重要的是要注意，着色均匀，表示大致均匀糊状的厚度。用打火机着色区域表示薄点，这是最好避免。 图4示出的20微米的6×6阵列×20平方微米的体素已被排出后，施主衬底的20X光学图像。在这种理想的情况下，存在在间隙中没有糊残留物中的所有体素被完全从色带喷射。如果能量不足，或者如果有显著热点中光束轮廓，体素将仅部分地分离并保持粘附在带的背面。 从像素喷出每年STES具有不同粘度可在图5 9，当膏粘度低， 即可以发现，没有得到充分的干燥，表面张力将导致体素变得更圆，失去其原来的形状（如在图5A和B中看到）。注意在图5B中的体素的形状是如何从光束形状（在图5B的插图显示）不同。在另一个极端，当浆料粘度高时， 也就是，已经过干燥，体素具有喷出时， 如图5C和D看到断裂的倾向。因此，存在其允许保留了光束剖面的形状， 如图5E和F看到非裂缝体素的转印的中间粘度范围。我们证明两个品种的体素链形成长导线的。首先是一个简单的终端到终端的连锁whicH 40×60微米的2体素相邻的转移到另一个（ 图6A和B）20。通常，此连接方法是有点不可靠，在100℃的软固化后出现的（如在图6B中看到的）部分地或完全断裂的接口。所用的第二种方法缺口，联锁传送端-端（ 图6C和D）体素。在图6C中的虚线勾勒的体素的原始形状，作为接口的高质量使得难以目视解决个别形状。这种效果是在图6D，其中体素之间的接缝是几乎看不见的很清楚。切口的几何形状较简单端至端更可靠，几乎所有接口100℃的固化后的剩余连续的。 图7显示各堆叠的几何形状，图案和长宽比。单体素遍历100μm的宽的Si沟槽可以在图7A中找到。获得合适的粘度是用于桥接或独立的应用程序的最重要的，以防止该体素从下垂或符合接收基板的几 ​​何形状。复杂的，多层结构可在图7B-D中可以看出，包括两个堆叠的金字塔和高纵横比的微柱。这些几何形状对于需要垂直和跨越互连应用很重要。最后， 图8A示出了使用商用DMD芯片，称为该图的"数字反射镜装置"的替代光学设置。如在步骤6中所述，大的，复杂的图像可以被加载到计算机，并与单个激光脉冲传送。一个成功打印NRL标志可以在图8B被发现。我们注意到，与单杆，就可以以1毫米的长度和特征R传输糊状结构的约20微米esolution。 <img alt="图1" src="/files/ftp_upload/53728/53728fig1.jpg" /> 图1. LDT设置的示意图。需要注意的是体素的形状由只对高粘度的油墨截面梁的形状决定。 <a href="https://www-jove-com.bdigitaluss.remotexs.co/files/ftp_upload/53728/53728fig1large.jpg" target="_blank">请点击此处查看该图的放大版本。</a> <img alt="图2" src="/files/ftp_upload/53728/53728fig2.jpg" /> 图2.示意图像素弹射。图示出了转让（A）的低粘度，（C）高粘度，和（E）中等粘度的变化。在（B），（D）和（F）分别设置在所得的体素的原子力显微镜图。这个数字已被修改<html>从[9]。 <a href="https://www-jove-com.bdigitaluss.remotexs.co/files/ftp_upload/53728/53728fig2large.jpg" target="_blank">请点击此处查看该图的放大版本。</a> <img alt="图3" src="/files/ftp_upload/53728/53728fig3.jpg" /> 图3.银纳米糊膏，施主衬底的图片。基材本身是一个1微米深井中心的载玻片。 <a href="https://www-jove-com.bdigitaluss.remotexs.co/files/ftp_upload/53728/53728fig3large.jpg" target="_blank">请点击此处查看该图的放大版本。</a> <img alt="图4" src="/files/ftp_upload/53728/53728fig4.jpg" /> 图4. 20X体素传输。夏普后色带（供体衬底）上的糊层的光学图像 ，定义良好的边缘和缺乏残基表明足够膏干燥和从色带材料的完全转移。jove.com/files/ftp_upload/53728/53728fig4large.jpg"目标="_空白"&gt;点击此处查看该图的放大版本。 <img alt="图5" src="/files/ftp_upload/53728/53728fig5.jpg" /> 图5.扫描电子显微镜（SEM）的几个不同的体素的图像。梁配置文件中的边界（B）的描绘。三种不同形状的体素从低粘度（A，B），高粘度（C，D），和中等粘度（E，F）打印。注意，尽管高粘度导致的体素压裂低粘度导致的形状和体素锐度的损失。这个数字已经从[9]。修改<a href="https://www-jove-com.bdigitaluss.remotexs.co/files/ftp_upload/53728/53728fig5large.jpg" target="_blank">请点击这里查看该图的放大版本。</a> 图6.联体素链的SEM图像连接两个几何体被描述:简单的端至端（A，B）和缺口联锁（C，D）。在一般情况下，缺口互锁几何形状被发现是更可靠的，而简单的端至端有在炉步骤由于收缩开裂的倾向。这个数字已经从[20]修改。 <a href="https://www-jove-com.bdigitaluss.remotexs.co/files/ftp_upload/53728/53728fig6large.jpg" target="_blank">请点击此处查看本图的放大版本。</a> <img alt="图7" src="/files/ftp_upload/53728/53728fig7.jpg" /> 图7.多个复杂的体素的结构的SEM图像几何包括:一个矩形体素桥接100μm的宽沟槽（A）中，多层小号<html> caffold（B）中 ，高纵横比金字塔（C），以及几个高纵横比的微柱（D）。这一数字已从[8]。修改<a href="https://www-jove-com.bdigitaluss.remotexs.co/files/ftp_upload/53728/53728fig7large.jpg" target="_blank">请点击这里查看该图的放大版本。</a> <img alt="图8" src="/files/ftp_upload/53728/53728fig8.jpg" /> 图8.示意图和通过DMD芯片LDT的结果。在示意图（A）中，激光孔径已被替换的DMD芯片，这是微反射镜的大部件。从映像文件模式可以忠实地成像在供体基板，单杆弹出体素的模式的翻版。作为一个例子，一个NRL标志（B）中已被一个单一的激光照射传送。ig8large.jpg"目标="_空白"&gt;点击此处查看该图的放大版本。

Watch this Scientific Journal Video about Laser-induced Forward Transfer of Ag Nanopaste at JoVE.com

Laser-induced Forward Transfer of Ag Nanopaste

We demonstrate the use of the Laser-induced forward transfer technique (LIFT) for the printing of high-viscosity Ag paste. This technique offers a simple, low temperature, robust process for non-lithographically printing microscale 2D and 3D structures.

银纳米糊膏的激光诱导正向传输

Over the past decade, there has been much development of non-lithographic methods1-3 for printing metallic inks or other functional materials. Many of ...

laser-induced-forward-transfer-of-ag-nanopaste

Research

JoVE Journal

Engineering

11.3K 次观看.  Naval Research Laboratory. We demonstrate the use of the Laser-induced forward transfer technique (LIFT) for the printing of high-viscosity Ag paste. This technique offers a simple, low temperature, robust process for non-lithographically printing microscale 2D and 3D structures.

视频: Laser-induced Forward Transfer of Ag Nanopaste

A Method to Fabricate Disconnected Silver Nanostructures in 3D

The standard nanofabrication toolkit includes techniques primarily aimed at creating 2D patterns in dielectric media. Creating metal patterns on a submicron scale requires a combination of nanofabrication tools and several material processing steps. For example, steps to create planar metal structures using ultraviolet photolithography and electron-beam lithography can include sample exposure, sample development, metal deposition, and metal liftoff. To create 3D metal structures, the sequence is repeated multiple times. The complexity and difficulty of stacking and aligning multiple layers limits practical implementations of 3D metal structuring using standard nanofabrication tools. Femtosecond-laser direct-writing has emerged as a pre-eminent technique for 3D nanofabrication.1,2 Femtosecond lasers are frequently used to create 3D patterns in polymers and glasses.3-7 However, 3D metal direct-writing remains a challenge. Here, we describe a method to fabricate silver nanostructures embedded inside a polymer matrix using a femtosecond laser centered at 800 nm. The method enables the fabrication of patterns not feasible using other techniques, such as 3D arrays of disconnected silver voxels.8 Disconnected 3D metal patterns are useful for metamaterials where unit cells are not in contact with each other,9 such as coupled metal dot10,11or coupled metal rod12,13 resonators. Potential applications include negative index metamaterials, invisibility cloaks, and perfect lenses.
In femtosecond-laser direct-writing, the laser wavelength is chosen such that photons are not linearly absorbed in the target medium. When the laser pulse duration is compressed to the femtosecond time scale and the radiation is tightly focused inside the target, the extremely high intensity induces nonlinear absorption. Multiple photons are absorbed simultaneously to cause electronic transitions that lead to material modification within the focused region. Using this approach, one can form structures in the bulk of a material rather than on its surface.
Most work on 3D direct metal writing has focused on creating self-supported metal structures.14-16 The method described here yields sub-micrometer silver structures that do not need to be self-supported because they are embedded inside a matrix. A doped polymer matrix is prepared using a mixture of silver nitrate (AgNO3), polyvinylpyrrolidone (PVP) and water (H2O). Samples are then patterned by irradiation with an 11-MHz femtosecond laser producing 50-fs pulses. During irradiation, photoreduction of silver ions is induced through nonlinear absorption, creating an aggregate of silver nanoparticles in the focal region. Using this approach we create silver patterns embedded in a doped PVP matrix. Adding 3D translation of the sample extends the patterning to three dimensions.

Femtosecond-laser direct-writing is frequently used to create three-dimensional (3D) patterns in polymers and glasses. However, patterning metals in 3D remains a challenge. We describe a method for fabricating silver nanostructures embedded inside a polymer matrix using a femtosecond laser centered at 800 nm.

一个断开连接的银纳米结构的方法来制作的3D

The standard nanofabrication toolkit includes  techniques primarily aimed at creating 2D patterns in dielectric media. Creating  metal patterns on a ...

科研

工程学

Evaluating Plasmonic Transport in Current-carrying Silver Nanowires

Plasmonics is an emerging technology capable of simultaneously transporting a plasmonic signal and an electronic signal on the same information support1,2,3. In this context, metal nanowires are especially desirable for realizing dense routing networks4. A prerequisite to operate such shared nanowire-based platform relies on our ability to electrically contact individual metal nanowires and efficiently excite surface plasmon polaritons5 in this information support. In this article, we describe a protocol to bring electrical terminals to chemically-synthesized silver nanowires6 randomly distributed on a glass substrate7. The positions of the nanowire ends with respect to predefined landmarks are precisely located using standard optical transmission microscopy before encapsulation in an electron-sensitive resist. Trenches representing the electrode layout are subsequently designed by electron-beam lithography. Metal electrodes are then fabricated by thermally evaporating a Cr/Au layer followed by a chemical lift-off. The contacted silver nanowires are finally transferred to a leakage radiation microscope for surface plasmon excitation and characterization8,9. Surface plasmons are launched in the nanowires by focusing a near infrared laser beam on a diffraction-limited spot overlapping one nanowire extremity5,9. For sufficiently large nanowires, the surface plasmon mode leaks into the glass substrate9,10. This leakage radiation is readily detected, imaged, and analyzed in the different conjugate planes in leakage radiation microscopy9,11. The electrical terminals do not affect the plasmon propagation. However, a current-induced morphological deterioration of the nanowire drastically degrades the flow of surface plasmons. The combination of surface plasmon leakage radiation microscopy with a simultaneous analysis of the nanowire electrical transport characteristics reveals the intrinsic limitations of such plasmonic circuitry.

Silver nanowires can simultaneously transport electrons and optical information in the form of surface plasmons. A procedure is described here to realize such a shared circuitry and the limitations at propagating both information carriers are evaluated.

Plasmonics is an emerging technology capable of simultaneously transporting a plasmonic signal and an electronic signal on the same information ...

Utilization of Plasmonic and Photonic Crystal Nanostructures for Enhanced Micro- and Nanoparticle Manipulation

A method to manipulate the position and orientation of submicron particles nondestructively would be an incredibly useful tool for basic biological research. Perhaps the most widely used physical force to achieve noninvasive manipulation of small particles has been dielectrophoresis(DEP).1 However, DEP on its own lacks the versatility and precision that are desired when manipulating cells since it is traditionally done with stationary electrodes. Optical tweezers, which utilize a three dimensional electromagnetic field gradient to exert forces on small particles, achieve this desired versatility and precision.2 However, a major drawback of this approach is the high radiation intensity required to achieve the necessary force to trap a particle which can damage biological samples.3 A solution that allows trapping and sorting with lower optical intensities are optoelectronic tweezers (OET) but OET's have limitations with fine manipulation of small particles; being DEP-based technology also puts constraint on the property of the solution.4,5
This video article will describe two methods that decrease the intensity of the radiation needed for optical manipulation of living cells and also describe a method for orientation control. The first method is plasmonic tweezers which use a random gold nanoparticle (AuNP) array as a substrate for the sample as shown in Figure 1. The AuNP array converts the incident photons into localized surface plasmons (LSP) which consist of resonant dipole moments that radiate and generate a patterned radiation field with a large gradient in the cell solution. Initial work on surface plasmon enhanced trapping by Righini et al and our own modeling have shown the fields generated by the plasmonic substrate reduce the initial intensity required by enhancing the gradient field that traps the particle.6,7,8 The plasmonic approach allows for fine orientation control of ellipsoidal particles and cells with low optical intensities because of more efficient optical energy conversion into mechanical energy and a dipole-dependent radiation field. These fields are shown in figure 2 and the low trapping intensities are detailed in figures 4 and 5. The main problems with plasmonic tweezers are that the LSP's generate a considerable amount of heat and the trapping is only two dimensional. This heat generates convective flows and thermophoresis which can be powerful enough to expel submicron particles from the trap.9,10 The second approach that we will describe is utilizing periodic dielectric nanostructures to scatter incident light very efficiently into diffraction modes, as shown in figure 6.11 Ideally, one would make this structure out of a dielectric material to avoid the same heating problems experienced with the plasmonic tweezers but in our approach an aluminum-coated diffraction grating is used as a one-dimensional periodic dielectric nanostructure. Although it is not a semiconductor, it did not experience significant heating and effectively trapped small particles with low trapping intensities, as shown in figure 7. Alignment of particles with the grating substrate conceptually validates the proposition that a 2-D photonic crystal could allow precise rotation of non-spherical micron sized particles.10 The efficiencies of these optical traps are increased due to the enhanced fields produced by the nanostructures described in this paper.

Plasmonic tweezers and photonic crystal nanostructures are shown to produce useful enhancements in the efficiency and orientation control of optically trapping micro- and nano-particles.

为增强微型和纳米操纵利用电浆和光子晶体纳米结构

A method to manipulate the position and orientation of submicron particles nondestructively would be an incredibly useful tool for basic biological ...

生物工程

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Flip-chip (FC) packaging is a key technology for realizing high performance, ultra-miniaturized and high-density circuits in the micro-electronics industry. In this technique the chip and/or the substrate is bumped and the two are bonded via these conductive bumps. Many bumping techniques have been developed and intensively investigated since the introduction of the FC technology in 19601 such as stencil printing, stud bumping, evaporation and electroless/electroplating2. Despite the progress that these methods have made they all suffer from one or more than one drawbacks that need to be addressed such as cost, complex processing steps, high processing temperatures, manufacturing time and most importantly the lack of flexibility. In this paper, we demonstrate a simple and cost-effective laser-based bump forming technique known as Laser-induced Forward Transfer (LIFT)3. Using the LIFT technique a wide range of bump materials can be printed in a single-step with great flexibility, high speed and accuracy at RT. In addition, LIFT enables the bumping and bonding down to chip-scale, which is critical for fabricating ultra-miniature circuitry.

We demonstrate the use of the Laser-induced Forward Transfer (LIFT) technique for flip-chip assembly of optoelectronic components. This approach provides a simple, cost-effective, low-temperature, fast and flexible solution for fine-pitch bumping and bonding on chip-scale for achieving high-density circuits for optoelectronic applications.

激光诱导转发转移单人死于倒装芯片封装

Flip-chip (FC) packaging is a key technology for realizing high performance, ultra-miniaturized and high-density circuits in the micro-electronics ...

Selective Area Modification of Silicon Surface Wettability by Pulsed UV Laser Irradiation in Liquid Environment

The wettability of silicon (Si) is one of the important parameters in the technology of surface functionalization of this material and fabrication of biosensing devices. We report on a protocol of using KrF and ArF lasers irradiating Si (001) samples immersed in a liquid environment with low number of pulses and operating at moderately low pulse fluences to induce Si wettability modification. Wafers immersed for up to 4 hr in a 0.01% H2O2/H2O solution did not show measurable change in their initial contact angle (CA) ~75&#176;. However, the 500-pulse KrF and ArF lasers irradiation of such wafers in a microchamber filled with 0.01% H2O2/H2O solution at 250 and 65 mJ/cm2, respectively, has decreased the CA to near 15&#176;, indicating the formation of a superhydrophilic surface. The formation of OH-terminated Si (001), with no measurable change of the wafer&#8217;s surface morphology, has been confirmed by X-ray photoelectron spectroscopy and atomic force microscopy measurements. The selective area irradiated samples were then immersed in a biotin-conjugated fluorescein-stained nanospheres solution for 2 hr, resulting in a successful immobilization of the nanospheres in the non-irradiated area. This illustrates the potential of&#160;the method for selective area biofunctionalization and fabrication of advanced Si-based biosensing architectures. We also describe a similar protocol of irradiation of wafers immersed in methanol (CH3OH) using ArF laser operating at pulse fluence of 65 mJ/cm2 and in situ formation of a strongly hydrophobic surface of Si (001) with the CA of 103&#176;. The XPS results indicate ArF laser induced formation of Si&#8211;(OCH3)x compounds responsible for the observed hydrophobicity. However, no such compounds were found by XPS on the Si surface irradiated by KrF laser in methanol, demonstrating the inability of the KrF laser to photodissociate methanol and create -OCH3 radicals.

We report on a process of in situ alteration of HF treated Si (001) surface into a hydrophilic or hydrophobic state by irradiating samples in microfluidic chambers filled with&#160;H2O2/H2O solution (0.01%-0.5%) or methanol solutions using pulsed UV laser of a relative low pulse fluence.

硅表面润湿性的选择区域改性脉冲紫外激光照射在液体环境

The wettability of silicon (Si) is one of the important parameters in the technology of surface functionalization of this material and fabrication of ...

Integration of Light Trapping Silver Nanostructures in Hydrogenated Microcrystalline Silicon Solar Cells by Transfer Printing

One of the potential applications of metal nanostructures is light trapping in solar cells, where unique optical properties of nanosized metals, commonly known as plasmonic effects, play an important role. Research in this field has, however, been impeded owing to the difficulty of fabricating devices containing the desired functional metal nanostructures. In order to provide a viable strategy to this issue, we herein show a transfer printing-based approach that allows the quick and low-cost integration of designed metal nanostructures with a variety of device architectures, including solar cells. Nanopillar poly(dimethylsiloxane) (PDMS) stamps were fabricated from a commercially available nanohole plastic film as a master mold. On this nanopatterned PDMS stamps, Ag films were deposited, which were then transfer-printed onto block copolymer (binding layer)-coated hydrogenated microcrystalline Si (&#181;c-Si:H) surface to afford ordered Ag nanodisk structures. It was confirmed that the resulting Ag nanodisk-incorporated &#181;c-Si:H solar cells show higher performances compared to a cell without the transfer-printed Ag nanodisks, thanks to plasmonic light trapping effect derived from the Ag nanodisks. Because of the simplicity and versatility, further device application would also be feasible thorough this approach.

A viable transfer printing-based methodology to introduce plasmonic metal nanostructures in solar cells is described. Using nanopillar poly(dimethylsiloxane) stamps, an Ag-based ordered nanodisk array was integrated with standard hydrogenated microcrystalline Si solar cells, which led to improved device performances due to plasmonic light trapping.

灯光诱杀银纳米结构通过转移印花在氢化微晶硅太阳能电池集成

One of the potential applications of metal nanostructures is light trapping in solar cells, where unique optical properties of nanosized metals, commonly ...

Plasmonic Trapping and Release of Nanoparticles in a Monitoring Environment

Plasmonic tweezers use surface plasmon polaritons to confine polarizable nanoscale objects. Among the various designs of plasmonic tweezers, only a few can observe immobilized particles. Moreover, a limited number of studies have experimentally measured the exertable forces on the particles. The designs can be classified as the protruding nanodisk type or the suppressed nanohole type. For the latter, microscopic observation is extremely challenging. In this paper, a new plasmonic tweezer system is introduced to monitor particles, both in directions parallel and orthogonal to the symmetric axis of a plasmonic nanohole structure. This feature enables us to observe the movement of each particle near the rim of the nanohole. Furthermore, we can quantitatively estimate the maximal trapping forces using a new fluidic channel.

A microchip fabrication process that incorporates plasmonic tweezers is presented here. The microchip enables the imaging of a trapped particle to measure maximal trapping forces.

电浆捕获和纳米粒子的释放在监控环境

Plasmonic tweezers use surface plasmon polaritons to confine polarizable nanoscale objects. Among the various designs of plasmonic tweezers, only a few ...

Production of Metal Nanoparticles by Pulsed Laser-ablation in Liquids: A Tool for Studying the Antibacterial Properties of Nanoparticles

The emergence of multidrug-resistant bacteria is a global clinical concern leading some to speculate about our return to a "pre-antibiotics" era of medicine. In addition to efforts to identify novel small-molecule antimicrobial drugs, there has been great interest in the use of metal nanoparticles as coatings for medical devices, wound dressings, and consumer packaging, due to their antimicrobial properties. The wide variety of methods available for nanoparticle synthesis results in a broad spectrum of chemical and physical properties which can affect antibacterial efficacy. This manuscript describes the pulsed laser-ablation in liquids (PLAL) method to create nanoparticles. This approach allows for the fine tuning of nanoparticle size, composition, and stability using post-irradiation methods as well as the addition of surfactants or volume excluders. By controlling particle size and composition, a large range of physical and chemical properties of metal nanoparticles can be explored which may contribute to their antimicrobial efficacy thereby opening new avenues for antibacterial development.

The antimicrobial properties of metals such as copper and silver have been recognized for centuries. This protocol describes pulsed laser-ablation in liquids, a method of synthesizing metal nanoparticles that provides the ability to fine tune the properties of these nanoparticles to optimize their antimicrobial effects.

液体中脉冲激光烧蚀制备金属纳米粒子:研究纳米粒子抗菌性能的工具

The emergence of multidrug-resistant bacteria is a global clinical concern leading some to speculate about our return to a "pre-antibiotics" era of ...

通过激光烧蚀合成纳米颗粒和纳米结构

Ultrafast Laser-Ablated Nanoparticles and Nanostructures for Surface-Enhanced Raman Scattering-Based Sensing Applications

The technique of ultrafast laser ablation in liquids has evolved and matured over the past decade, with several impending applications in various fields such as sensing, catalysis, and medicine. The exceptional feature of this technique is the formation of nanoparticles (colloids) and nanostructures (solids) in a single experiment with ultrashort laser pulses. We have been working on this technique for the past few years, investigating its potential using the surface-enhanced Raman scattering (SERS) technique in hazardous materials sensing applications. Ultrafast laser-ablated substrates (solids and colloids) could detect several analyte molecules at the trace levels/mixture form, including dyes, explosives, pesticides, and biomolecules. Here, we present some of the results achieved using the targets of Ag, Au, Ag-Au, and Si. We have optimized the nanostructures (NSs) and nanoparticles (NPs) obtained (in liquids and air) using different pulse durations, wavelengths, energies, pulse shapes, and writing geometries. Thus, various NSs and NPs were tested for their efficiency in sensing numerous analyte molecules using a simple, portable Raman spectrometer. This methodology, once optimized, paves the way for on-field sensing applications. We discuss the protocols in (a) synthesizing the NPs/NSs via laser ablation, (b) characterization of NPs/NSs, and (c) their utilization in the SERS-based sensing studies.

作者聚焦:通过液体中的激光烧蚀进行纳米颗粒合成的进展和应用 

Ultrafast laser ablation in liquid is a precise and versatile technique for synthesizing nanomaterials (nanoparticles [NPs] and nanostructures [NSs]) in liquid/air environments. The laser-ablated nanomaterials can be functionalized with Raman-active molecules to enhance the Raman signal of analytes placed on or near the NSs/NPs.

超快激光烧蚀纳米颗粒和纳米结构在基于表面增强拉曼散射的传感应用中的应用

The technique of ultrafast laser ablation in liquids has evolved and matured over the past decade, with several impending applications in various fields ...

银纳米糊膏的激光诱导正向传输

摘要

探索更多视频

此视频中的章节

一个断开连接的银纳米结构的方法来制作的3D

Evaluating Plasmonic Transport in Current-carrying Silver Nanowires

为增强微型和纳米操纵利用电浆和光子晶体纳米结构

激光诱导转发转移单人死于倒装芯片封装

硅表面润湿性的选择区域改性脉冲紫外激光照射在液体环境

灯光诱杀银纳米结构通过转移印花在氢化微晶硅太阳能电池集成

电浆捕获和纳米粒子的释放在监控环境

液体中脉冲激光烧蚀制备金属纳米粒子:研究纳米粒子抗菌性能的工具

超快激光烧蚀纳米颗粒和纳米结构在基于表面增强拉曼散射的传感应用中的应用

超快激光烧蚀纳米颗粒和纳米结构在基于表面增强拉曼散射的传感应用中的应用